LINK-PP LPJG0926HENLS4R RJ45 LAN for Through-Hole Reflow

Through-Hole Reflow (THR) technology is a technology used to solder through-hole components to surface mount (Surface Mount) circuit boards (PCBs). ) on the welding method. They were typically used in electronic components that require high mechanical strength and reliability, such as RJ45 connectors.

Basic working principle：

1. Component installation: First, insert the pins of an RJ45 connector into the pre-drilled holes on the PCB. The component pins will go through the PCB and come out the other side.

2. Solder paste printing: Printing solder paste, usually lead-free solder paste, on the through holes of the PCB. The main components of solder paste are solder particles and flux.

3. Preheating stage: PCB enters the preheating zone of the reflow oven, and the solder paste is gradually heated to the temperature range for flux activation. The function of this stage is to remove volatile components from the solder paste and prevent solder beads from being produced during the soldering process.

4. Reflow soldering: The PCB continues to move to the reflow area, and the temperature further rises to the solder melting point (about 217°C to 245°C). The solder paste melts to form liquid solder, which fully wets and combines with the component pins and PCB pads.

5. Cooling and solidification: PCB enters the cooling zone, and the solder quickly cools and solidifies to form a stable solder joint. The electrical and mechanical connection between the component pins and the PCB pads is now complete

LINK-PP chooses through-hole reflow (THR) technology for RJ45 connectors, which can provide higher physical strength and better signal integrity while simplifying the production process. The equipped production equipment includes:

• Reflow oven: multi-temperature zone control, precise temperature curve.
• Solder paste printing machine: high-precision printing to ensure even distribution of solder paste.
• Component fixing equipment: clamps or patch glue to fix components.
• Testing equipment: AOI equipment and X-ray testing to ensure the quality of solder joints.

THR technology significantly improves the mechanical reliability of connectors by providing a strong solder joint connection. The soldered pins make reliable contact with the PCB surface, reducing the risk of loose or detached pins. Reduces welding heat and thermal stress during welding, reducing the risk of damage to electrical connections.

THR technology utilizes automated production processes to ensure the consistency and stability of the welding process. By precisely controlling the temperature and time of hot air, the influence of human factors is reduced.

LINK-PP strictly controls quality and monitors and detects each welding process to reduce the occurrence of welding defects and defective products and ensure that the welding quality meets the requirements.

LINK-PP launched LPJG0926HENLS4R, a connector design that applies THR technology, applicable for Gigabit Power Over Ethernet Devices , Similar Series can also convert 10/100Base-T, 2.5G,5G,10G POE and None POE.

Dimensions:

Recommended land pattern from datasheet LINK-PP THR RJ45 LPJG0926HENLS4R:

LPJG0926HENLS4R.pdf

Welding temperature curve:

LINK-PP LPJG0926HENLS4R THR PoE+ RJ45 Connector has obvious advantages in applications in network equipment, communication equipment, industrial automation, and other fields.

1. LPJG0926HENLS4R utilizes thermoplastic PA46+30%G.F Housing Material with high melting point and low humidity absorption.
2. LPJG0926HENLS4R With a maximum reflow temperature of 250°C for 5 seconds, ensures optimal soldering performance.
3. The stand-off height between the PCB and component facilitates better airflow and provides sufficient space for solder paste.
4. Pin Length: With pins extending 2.40mm from the PCB surface, LPJG0926HENLS4R ensures optimal soldering effectiveness.
5. LINK-PP's LPJG0926HENLS4R avoids the problem that soldering points that are more than 1 mm away from the outer edge of RJ45 will not be soldered correctly because the reflow heat does not completely melt the solder paste.
6. LINK-PP uses high-viscosity solder paste in through-hole reflow (THR) soldering applications.

LINK-PP will understand the innovation and improvement of THR technology, how to use THR technology to reduce product maintenance and replacement costs, and give full play to the contribution of THR technology in lowering production costs and improving production efficiency.