JXD0-0002NL 1000Base-T Magjack RJ45 Magnetics Connector Through Hole

JXD0-0002NL RJ45 Connector Material Specifications:

These carefully selected materials and plating options enhance the overall functionality of the JXD0-0002NL RJ45 With Magnetics. Such as elasticity, conductivity, durability, and suitability for various application scenarios.

1. Housing Material: Thermoplastic Black UL94 V-0
The housing is constructed from high-quality thermoplastic material in a sleek black color, meeting the UL94 V-0 flammability rating for enhanced safety.

2. Shield: Brass
The shielded portion is made of durable brass, providing this RJ45 Magjack with strong protection and stability.

3. Shield Plating: Nickel
The shielding layer is nickel-plated to enhance the corrosion resistance of the RJ45 Magnetics Connector.

4. Contact Material: Phosphor Bronze
The contacts, essential for reliable electrical conductivity, are made of phosphor bronze, a material known for its electrical properties and elasticity.

5. Contact Plating: Selective Gold, 30 Micro-inches minimum in the contact area
The contacts feature a layer of selective gold plating with a minimum thickness of 30 micro-inches in the contact area. This gold plating ensures excellent electrical conductivity and corrosion resistance.

6. Pins: Brass C2680R-H, Thickness=0.35mm
The pin is made of brass (C2680R-H) and is 0.35 mm thick. Brass pins contribute to the overall structural integrity and electrical performance of the connector.

Product Detail of RJ45 With Magnetics:

JXD0-0002NL(LPJG4887GENL) Datasheet:

LPJG4887GENL.pdf

Advantages of Reflow Soldering:

Reflow soldering is a widely used method in electronics manufacturing to secure surface-mount components to printed circuit boards (PCBs). It offers several advantages over traditional manual welding methods. SMT pins in this RJ45 Magnetics connector allow for reflow soldering. It can improve production efficiency while ensuring welding quality. Here is a brief introduction to its advantages:

Automation and High Throughput:

Reflow soldering enables efficient, fast and automated PCB assembly. Automated systems can process large numbers of boards simultaneously, increasing overall production throughput.

Consistent and Precise Soldering:

Reflow soldering ensures consistent solder joint quality across the entire PCB. The process creates precise and clean solder connections, reducing the chance of soldering defects.

Fine-pitch and small-component compatibility:

Reflow soldering is suitable for fine-pitch components and small surface mount devices (SMD). This process can handle components with small spacing on PCBs that would be cumbersome to handle manually.

Reduced Solder Bridging and Tombstoning:

Reflow soldering helps reduce common soldering defects such as solder bridging (accidental connections between adjacent solder joints) and tombstones (components standing up on one end). Controlled heating and cooling phases both prevent these problems.

Better Heat Distribution:

Reflow soldering technology distributes heat more evenly across the entire PCB, reducing thermal stress on components. This reduces the risk of damaging sensitive electronic equipment during soldering.

Lead-Free Soldering Compliance:

Reflow soldering is suitable for lead-free soldering processes and meets environmental protection requirements for reducing harmful substances.

Process Control and Monitoring:

Reflow soldering equipment often has control and monitoring capabilities. Parameters such as temperature profiles, conveyor belt speeds and atmosphere control can be precisely managed.

Cost-Effectiveness:

Although the cost of reflow soldering equipment may be relatively high, the automation and efficiency of the process can lead to cost savings in mass production.