Product Details
Place of Origin: GuangDong, China
Brand Name: LINK-PP
Certification: UL,ROHS,Reach,ISO
Model Number: ARJM11B1-809-NN-ER2-T
Payment & Shipping Terms
Minimum Order Quantity: 50/500/1000
Price: Supportive
Packaging Details: 50/ tray,24tray in 1 carton, which is 37*30*30 cm, 9KGS (1200 pcs) / carton
Delivery Time: Stock
Payment Terms: TT,NET30/60/90 Days
Supply Ability: 3000000/Month
Model: |
ARJM11B1-809-NN-ER2-T |
Manufacturer PN: |
LPJxxxxxxxNL Series |
Interface: |
2.5G Mbps |
Termination: |
Solder |
LEDs: |
Optional |
Samples: |
Free |
Model: |
ARJM11B1-809-NN-ER2-T |
Manufacturer PN: |
LPJxxxxxxxNL Series |
Interface: |
2.5G Mbps |
Termination: |
Solder |
LEDs: |
Optional |
Samples: |
Free |
| Connector Type | RJ45 | |
|---|---|---|
| Number of Ports | 1 | |
| Number of Rows | 1 | |
| Applications | 2.5G Base-T, AutoMDIX | |
| Mounting Type | Through Hole | |
| Orientation | 90° Angle (Right) | |
| Termination | Solder | |
| Height Above Board | 0.535" (13.59mm) | |
| LED Color | Does Not Contain LED | |
| Number of Cores per Jack | 8 | |
| Shielding | Shielded | |
| Features | Board Lock | |
| Tab Direction | Down | |
| Contact Material | - | |
| Contact Finish | Gold | |
| Operating Temperature | -40°C ~ 85°C | |
| Contact Finish Thickness | 6.00µin (0.152µm) |
Applications For Terminal User
Designed to support applications, such as ADSL modems, LAN-on-Motherboard. Networking and communication equipments such as HUB, PC card, Switch, Router, PC Mainboard, SDH, PDH, IP Phone, xDSL modem,Call Center solutions , Complex set top boxes , VOIP gateways setup,Border Gateway Protocol,fast ethernet switch ...
Competitive Advantage
19 years production experience,
2600 staff,
100% test
Flexible delivery time
Main Customer
Design for Ti , Intel , Samsung , Fluke , Jabil , Flextronics ,Cypress, Freescale,EKF.......
EMS Application
Built-in Flexible PCB Assembly; Rigid-Flexible PCB Assembly; Microelectronic, Flip Chip; Microelectronic, Chip On Board; Optoelectronic Assembly; RF / Wireless Assembly; Through Hole Assembly; Surface Mount Assembly; System Assembly; Printed Circuit Board Assembly
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