Product Details
Place of Origin: GuangDong, China
Brand Name: LINK-PP
Certification: UL,RoHS,Reach,ISO
Model Number: 1840028-1
Payment & Shipping Terms
Minimum Order Quantity: 50/500/1000/60K
Price: $0.11-$24
Packaging Details: Tray
Delivery Time: Stock
Payment Terms: TT,NET30/60/90 Days
Supply Ability: 180K/Month
Part Number: |
1840028-1 / 1840026-1 |
Number Of Ports: |
1X1 And 2 USB A |
Connector Type: |
Rj45 USB Connector Combo |
Applications: |
10/100BASE-T |
Mounting Type: |
Through Hole Mount |
Orientation: |
90～ Angle (Right) |
Termination: |
Solder |
EMI Tabs: |
Shielded With EMI Finger |
Part Number: |
1840028-1 / 1840026-1 |
Number Of Ports: |
1X1 And 2 USB A |
Connector Type: |
Rj45 USB Connector Combo |
Applications: |
10/100BASE-T |
Mounting Type: |
Through Hole Mount |
Orientation: |
90～ Angle (Right) |
Termination: |
Solder |
EMI Tabs: |
Shielded With EMI Finger |
| Category | Specification |
|---|---|
| Number of Ports | 1×1 RJ45 + 2× USB A |
| Ethernet Speed | 10/100BASE-T |
| Impedance | 100 Ω |
| Turns Ratio (Chip: Cable) | TX = 1:1, RX = 1:1 |
| Open Circuit Inductance (OCL) | 350 µH Min @ 100 kHz, 0.1 Vrms, 8 mA DC Bias (0°C to 70°C) |
| Insertion Loss (IL) | 1.1 dB Max from 0.5 MHz to 100 MHz |
| Return Loss (RL) | ≥ 18 dB from 0.5 MHz to 30 MHz ≥ [18–20·log(f/30)] dB from 30.1 MHz to 60 MHz ≥ 12 dB from 60.1 MHz to 80 MHz |
| Crosstalk Attenuation | ≥ 35 dB from 5 MHz to 40 MHz ≥ [33–20·log(f/50)] dB from 40.1 MHz to 100 MHz |
| Common Mode Rejection (CMRR) | ≥ 30 dB from 0.5 MHz to 100 MHz |
| Isolation Voltage | Meets IEEE 802.3 Standard |
| Port Configuration | Tab Up RJ45 with USB |
| Height Profile | Standard |
| LED Indicator | Yes (Green/Orange) |
| EMI Tabs | Yes |
| Mounting Type | Through-Hole |
| Operating Temperature | 0°C to +70°C |
| RoHS Compliance | Yes |
Material: Phosphor Bronze, 0.30 mm Thickness
Plating: 1.27 μm Min. Overall Nickel Underplate
Mating Area: Selective Gold Plating (thickness per specification)
Solder Tails: 2.54 μm Min. Matte Tin and/or SAC Solder
2.03 μm Min. Silver over
1.02 μm Min. Nickel underplate over
1.02 μm Copper base
Post-Dipped with: 2.54 μm Min. Matte Tin and/or SAC Solder or Pure Tin
