Payment & Shipping Terms:
|Interface:||4x 10/100Base-T||Port:||Single SMD|
|Archivi Disponibili:||PDF/3D/ISG/Stp/Step/Datasheet||Cross:||81FB-22FNL = LP1164NL|
|Quad Port, 10/100 BASE-T Ethernet Power Transformer Price, SMD,Rohs|
|LINK-PP Part Number||LP1164NL|
|Other Part Number||81FB-22FNL|
|Number of Ports||QUAD|
|Application - LAN||ETHERNET (NON PoE)|
|Temperature||0 TO +70|
|Comment||SAME AS NL VERSION|
|Cores Per Port||16|
|Package Height (Inches)||0.26|
|Package Height (mm)||6.6|
|Package Length (Inches)||1.125|
|Package Length (mm)||28.58|
|Package Width (Inches)||0.63|
|Package Width (mm)||16.00|
|Turns Ratio RX||1CT:1CT|
|Turns Ratio TX||1CT:1CT|
Why Choose Us
World’s Leader Supplier Of Integrated RJ45 Connector And Discrete Magnetic Transformers
Professional team get together, focus on R and D and design
LINK-PP set up R and D technology center, has a more than 300 people of engineering R and D team, the team is using engineering analysis technique and design of fast to submit customer requirements. The advanced technology and outstanding quality are regarded as the core pillar of enterprise operation, continuous research and development, and high investment in leading technology.
Mould design ability
LINK-PP have an innovative mold design team to develop high precision, low cost and high efficiency mold with the design concept of the standard mould base can be fast changing. The team is more equipped with the mould design ability of the small spacing multi-mode hole and the high-speed multi-line.
Independent R and D capacity
Our team uses professional engineering analysis technique (tolerance analysis and PFMEA) and simulation software (FEM, mold flow analysis) to avoid design error and make sure our products can meet the specification, moreover, can reduce the development time of project. And our rapid response to the customer's design proposal can help to reduce the cost because of re-fixing mold.
Design for Ti , Intel , Samsung , Fluke , Jabil , Flextronics ,Cypress, Freescale,EKF.......
Built-in Flexible PCB Assembly; Rigid-Flexible PCB Assembly; Microelectronic, Flip Chip; Microelectronic, Chip On Board; Optoelectronic Assembly; RF / Wireless Assembly; Through Hole Assembly; Surface Mount Assembly; System Assembly; Printed Circuit Board Assembly