SM91502AL BMS Transformer

SM91502AL BMS Transformer datasheet: https://www.bourns.com/docs/product-datasheets/SM91502AL.pdf
Electrical Specifications @ 25 °C:
OCL
(100 kHz, 0.1 V, (-40 °C ~ +125 °C)
150 µH min.,
450 µH max.
Leakage Inductance
(100 kHz, 0.1 V) 0.5 µH max.
DCR
Transformer Side 0.45 ohms max.
CM Choke Side 0.85 ohms max.
Turns Ratio 1:1 ±2 %
Insertion Loss
4 MHz -0.25 dB max.
Return Loss (Z out = 100 ohms)
4 MHz -22 dB min.
Common Mode Rejection Ratio
1~100 MHz -35 dB min.
100~200 MHz -28 dB min.
Hi-Pot (1 mA, 60 sec.)
4300 VDC
Working Voltage 1000 VDC
Design Construction
Functional insulation
Operating Temperature Range
-40 °C to +125 °C
Storage Temperature Range
-25 °C to +85 °C
Moisture Sensitivity Level 1
ESD Classification (HBM) N/A
Packaging Specifications
Tape & Reel 800 pcs./13-inch reel
Termination: Cu/Ni/Sn (RoHS compliant*)
Features
One channel with choke
Supports serial daisy chain / IsoSPI
Holds reference designs with Analog
Device’s Model LTC6804-1/6811 and
NXP’s MC33771/33772
Operating temperature: -40 to +125 °C
1000 VDC working voltage
Hi-Pot: 4300 VDC
AEC-Q200 compliant
RoHS compliant*
SM91502AL BMS Transformer Electrical Schematic
SM91502AL BMS Transformer Recommended PCB Layout
SM91502AL BMS Transformer Dimensions
 

LP12AC02000B 1x2 SFP Cage With EMI Spring Finger Overview

LP12AC02000B is a 1x2 standard SFP cage with EMI spring finger shielding design, developed for compact pluggable optical transceiver interface applications requiring reliable mechanical retention, stable grounding continuity, and improved electromagnetic interference suppression.

Manufactured from nickel-plated copper alloy and designed with press fit compliant pin termination, this dual-port SFP cage offers durable PCB mounting performance while simplifying large-scale automated assembly. Its integrated EMI spring fingers enhance conductive contact between the cage and bezel panel, helping reduce front-port EMI leakage in communication hardware.

With a 4Gb/s maximum recommended application rate, no lightpipe, no integrated heatsink, and a wide -55°C to +105°C operating temperature range, LP12AC02000B is well suited for telecom boards, fiber media converters, industrial Ethernet devices, and standard SFP optical uplink equipment where space efficiency and shielding stability are required.

Specifications of 1x2 Press Fit SFP Cage

LP12AC02000B SFP Cage Drawing - Recommended PCB Layout

Mechanical & Design Parameters

LP12AC02000B is manufactured with precise dimensional control to ensure stable insertion alignment and reliable compatibility with professional hardware platforms:

• Component Height: 9.75 mm
• Component Width: 28.75 mm
• Overall Assembly Length: 50.00 mm
• Connector Hole Diameters: Ø0.95 ± 0.05 mm (12 positions), Ø1.05 ± 0.05 mm (18 positions)
• EMI Shielding: Integrated EMI spring fingers provide continuous conductive bezel contact for improved electromagnetic suppression
• PCB Application: Recommended for single-sided PCB applications with designated component keep-out zones
• General Tolerances: X ±0.20, XX ±0.15, XXX ±0.10

LP12AC02000B 1x2 SFP Cage Packaging Details

To ensure dimensional consistency and mechanical protection during storage, internal handling, and bulk transportation, LP12AC02000B is supplied in standardized industrial tray packaging suitable for OEM production and warehouse management.

• Packaging Type: Tray Packaging
• Quantity per Tray: 28 PCS
• Tray Stack Configuration: 8 Overlayed Trays
• Total Quantity per Box: 224 PCS
• Tray Orientation: Alternating 180° rotation for improved stacking stability
• Outer Carton Dimensions: 340 mm (L) × 265 mm (W) × 200 mm (H)

This packaging arrangement helps minimize deformation risk of the EMI spring structure during shipment while improving counting efficiency and production line material control for volume assembly environments.